Xiaomi is preparing to include 3D smartphones in its smartphone portfolio, which has been revealed in the latest report. According to the report, the company has patented the design for its 3D smartphone, which has also been approved within a month. The report also shared pictures of the smartphone, in which one can glimpse the design of this upcoming phone. This 3D smartphone from Xiaomi will come with a unique quad rear camera setup, with four sensors located on all four sides of the back panel of the phone.
According to a report by LetsGoDigital, the Xiaomi company has patented the design of the 3D smartphone in collaboration with The Hague International Design Bulletin last month. Interestingly, the designed patent has also been approved within a month. A glimpse of the design of the phone is also shown in this report. The quad rear camera setup can be seen on the back of the phone, although this camera setup is a bit unique. In which all four sensors are located on the four sides of the back of the phone.
Photo Credit: LetsGoDigital
Apart from this, talking about the front panel of the phone, it has not seen any kind of knock, hole-punch and pop-up module for the selfie camera. From which it can be guessed that under-display camera can be given for selfie in the phone.
With this, the power button and volume rocker can be seen on the right side of the phone, while the SIM card tray slot is located on the left side. At the same time, the bottom of the phone will have a USB Type-C port, 3.5mm headphone jack and microphone hole as well as a speaker grill.
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